How India's Semiconductor Policy Works

India has identified semiconductor manufacturing and design as a strategic national priority, motivated by the supply chain disruptions of the COVID-19 era (which exposed India's complete dependence on foreign chips for automobiles, electronics, medical devices, and telecommunications equipment) and by the growing consensus that semiconductor supply chains will be a geopolitical flashpoint in the coming decades. 

The India Semiconductor Mission (ISM) — launched under the Programme for Development of Semiconductors and Display Manufacturing Ecosystem in 2021 with an initial outlay of ₹76,000 crore ($9.2 billion) — provides fiscal incentives of up to 50% of project cost for semiconductor fabrication and display manufacturing. 

How India's Semiconductor Policy Works
Representational Image: How India's Semiconductor Policy Works
The scheme attracted the first concrete investments: Micron Technology (US semiconductor company) is building India's first modern semiconductor assembly, testing, marking, and packaging (ATMP) facility in Sanand, Gujarat, with an investment of approximately ₹22,500 crore and ISM support; Tata Electronics (Tata Group) is building India's first semiconductor fabrication plant — a 28nm technology fab — in Dholera, Gujarat, in partnership with Powerchip Semiconductor Manufacturing Corporation (PSMC) of Taiwan.

India's semiconductor ambition is primarily in semiconductor design (where India already has significant expertise — thousands of Indian engineers work in global semiconductor design teams at Qualcomm, Intel, AMD, Arm, Texas Instruments, and others) and in advanced packaging and testing (ATMP) — the downstream steps that follow wafer fabrication. Entering leading-edge chip fabrication (5nm, 3nm processes) would require investments in the hundreds of billions of dollars and technology access that is currently restricted by US export controls; India's realistic near-term ambition is legacy node fabrication (28nm and above), advanced packaging, and continued growth in design.

What You Need to Know

  • India Semiconductor Mission: ₹76,000 crore ($9.2 billion) outlay announced; 50% fiscal support for semiconductor fab projects; ISM under Ministry of Electronics and Information Technology (MeitY); attracted commitments from Tata/PSMC (first semiconductor fab) and Micron (ATMP facility).
  • Tata/PSMC fab (Dholera, Gujarat): India's first semiconductor fabrication facility; 28nm mature node technology; ₹91,000 crore investment (Tata + government support); expected to produce chips by 2026–27; will primarily serve automotive, industrial, and consumer electronics demand that does not require cutting-edge nodes.
  • Micron ATMP (Sanand, Gujarat): approximately ₹22,500 crore investment; ATMP = Assembly, Testing, Marking, Packaging; takes completed wafers from foundries and packages them into chips; expected to be operational 2024–25; represents the packaging step of the semiconductor supply chain, not wafer fabrication; employment: approximately 5,000 direct and 15,000 indirect.
  • Chip design strength: India has approximately 20,000+ semiconductor design engineers; Bengaluru, Hyderabad, Pune, and Noida host major chip design centres for Qualcomm, Intel, AMD, Arm, NVIDIA, Broadcom, and others; India designed significant portions of major chip architectures; the design talent exists; translating to domestic design companies requires venture capital and IP framework development.
  • India Semiconductor Mission and Chip4 Alliance: India's semiconductor strategy aligns with US-India strategic technology cooperation under the iCET (Initiative on Critical and Emerging Technologies) framework; the US is sharing some (restricted) semiconductor technology with India; India is a peripheral member of the US-Japan-South Korea-Taiwan "Chip4" supply chain alignment.

How It Works in Practice

1. Why 28nm rather than leading-edge: TSMC's 3nm facility cost $20+ billion; requires access to ASML's EUV lithography machines (restricted under US/Netherlands export controls); requires deep lithography expertise that India does not have. 28nm technology is commercially mature; equipment is more widely available; the technology gap with cutting edge is 10+ years but the investment gap is 10x smaller. Most consumer electronics, automotive chips, and industrial sensors use 28nm or older nodes; India can compete in this segment.

2. The design-to-manufacturing strategy: India's realistic near-term semiconductor strategy is: lead with design talent (already present), build ATMP capacity (Micron), develop domestic fabless chip design companies (using India's design talent), and gradually develop domestic fabrication capability starting from 28nm. This is the "climb the value chain from design" strategy rather than the Taiwan/South Korea "start with fabrication and build backward" strategy.

3. VLSI engineer training: The India Semiconductor Mission includes a ₹30,000 crore package for semiconductor design and VLSI (Very Large Scale Integration) training, aiming to produce 85,000 trained VLSI professionals; NIT/IIT semiconductor design courses; a dedicated semiconductor design training ecosystem. This talent pipeline investment acknowledges that design talent is India's differentiator.

4. Industry associations and ecosystem: The India Electronics & Semiconductor Association (IESA) and the Indian Semiconductor Association (ISA) represent the sector; they advocate for improved IP protection, EDA (Electronic Design Automation) software access, power infrastructure, and clean room standards; the ecosystem requires not just fabs but chemical suppliers, equipment maintenance, and specialised infrastructure that is absent in India.

5. The supply chain geopolitics dimension: India's semiconductor policy is partly a geopolitical choice — reducing dependence on Taiwan (80% of advanced chip supply, across the Taiwan Strait from China) and aligning with US-led semiconductor supply chain restructuring (CHIPS Act, US FDI requirements). The strategic dimension means government support exceeds what commercial investment alone would justify; semiconductor policy is defence and supply chain policy as much as industrial policy.

What People Often Misunderstand

  • India is not building cutting-edge chip fabs: The Tata/PSMC 28nm fab is significant for India but is 2–3 technology generations behind TSMC's leading-edge offering; India's chips will serve mid-tier markets, not AI accelerators, mobile phone SoCs, or next-generation computing.
  • ATMP is not the same as fabrication: Micron's Sanand facility is an ATMP — packaging completed wafers into chips — not a wafer fabrication facility; this is a downstream step, not the primary semiconductor manufacturing process; India does not yet have a wafer fab in operation.
  • The ₹76,000 crore headline understates total required investment: ISM's fiscal support covers 50% of project cost up to defined limits; the total investment mobilised (including Tata's own capital, Micron's investment, state government support) is significantly larger than the central ISM outlay.
  • Semiconductor manufacturing is extraordinarily capital and expertise intensive: Taiwan's TSMC took 30+ years to reach its current leading position; Intel's manufacturing leadership took 40+ years; India's 2021 entry should be assessed on a decade-scale timeline, not annual achievements.
  • Design talent does not automatically translate to semiconductor companies: India has excellent employed VLSI designers at multinational GCCs; it has relatively few domestic semiconductor design startups and even fewer domestic chip companies with market presence; converting employee talent into entrepreneurial chip design companies requires IP protections, risk capital, and customer relationships that India's ecosystem is still developing.

What Changes Over Time

The Tata/PSMC fab's planned production start (2026–27) will be the most significant semiconductor policy milestone of the near term; if successful, it will demonstrate India's ability to operate a semiconductor fabrication facility and attract additional investment. 

The iCET framework's semiconductor technology cooperation with the US — potentially including export licence facilitation for more advanced tooling — will depend on India's strategic alignment remaining consistent with US technology policy.

Sources and Further Reading

(This series is part of a long-term editorial project to explain the structures, institutions, technologies, and policy frameworks that shape governance in India for a global audience. Designed as a 25-article briefing cluster on Digital India, Platforms & AI Governance, this vertical examines how India is building and regulating one of the world's largest digital societies — from Aadhaar, UPI, DigiLocker, Digital Public Infrastructure (DPI), and fintech innovation to data protection, cybersecurity, platform regulation, artificial intelligence governance, digital inclusion, online rights, and the future of the state's relationship with technology. Written in an accessible format for diplomats, investors, researchers, technology professionals, NGOs, civil society actors, students, academics, policymakers, and international observers, the series seeks to explain both how India's digital architecture is designed and how it functions in practice across a population of more than 1.4 billion people. Particular attention is given to the opportunities, trade-offs, institutional debates, and governance challenges created by rapid digital transformation. This is Vertical 8 of a larger 20-vertical knowledge architecture being developed by IndianRepublic.in under the editorial direction of Saket Suman. All articles are protected under applicable copyright laws. All Rights Reserved.)
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